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用于先進SiC功率模塊的整體解決（核心設備/材料/工程）方案Overall solution (core equipment/materials/engineering) for advanced SiC power module周鑫蘇州博湃半導體技術有限公司市場銷售總監ZHOU XinDirector of Sales Marketing, Suzhou Bopai Semiconductor Technology Co., Ltd.

SiC功率器件制造工藝特點與核心裝備創新進展Manufacturing process characteristics and key equipment development of SiC power devices鞏小亮中國電子科技集團公司第四十八研究所 半導體裝備研究部副主任GONGXiaoliang Deputy director of Semiconductor equipment research department, the 48th Research Institute of China Electronics Technology Group Corporation