青禾晶元董事長(zhǎng)兼總經(jīng)面向Micro-LED封裝的先進(jìn)半導(dǎo)體鍵合集成技術(shù)Advanced Semiconductor Bonding Technology for Micro-LED Integration母鳳文北京青禾晶元半導(dǎo)體科技有限責(zé)任公司董事長(zhǎng)兼總經(jīng)理MU FengwenPresident and General Manager of Innovative Semiconductor Substrate Technology co., Ltd.
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