中科院微電子所副研究高可靠功率系統集成的發展和挑戰Development and Challenge of High-Reliability Power System in Packaging侯峰澤中國科學院微電子研究所系統封裝與集成研發中心副研究員Fengze HOUAssociate Professor、 Packaging and Integration Research and Development Center, Institute of Microelectronics of Chinese Academy of Sciences
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