2024年11月18-21日，第十屆國際第三代半導體論壇（IFWS2024）&第二十一屆中國國際半導體照明論壇（SSLCHINA2024）、先進半導體技術應用創新展（CASTAS）將在蘇州國際博覽中心G館舉辦。合美半導體（北京）有限公司誠邀第三代半導體產業同仁共聚論壇。 

公司簡介

合美半導體（北京）有限公司成立于北京。自成立以來一直致力于化合物半導體材料精密研磨和拋光機臺研制以及前沿工藝的開發，產品廣泛引用于紅外材料，第三代半導體材料，氧化稼，單晶/多晶金剛石，多晶碳化硅，光纖，鈮酸鋰，碳酸鋰等材料的高精度研磨和拋光。國內主要用戶多為知名研究院所、大學及上市企業，以技術的先進性及設備的可靠性獲得了業內的一致好評！同時與知名大學共建聯合實驗室，共享國際最前沿的研磨拋光工藝。

Homewell Semiconductor (Beijing) Co., Ltd. was established in Beijing. Since its establishment, it has been dedicated to the development of precision Lapping and Polishing Equipment for compound semiconductors and advanced process development. Our products are widely used in High-precision lapping and polishing of Infrared Materials, third-generation semiconductor materials, Ga?O?, C, PKD, polycrystalline SiC, FIBRE, LiNbO?, Li?CO?, etc. for High-precision Lapping and Polishing. 

Most of domestic users are well-known research institutes, universities, and listed companies, and we have gained consistent from the industry for its technological advancement and equipment reliability! Meanwhile, we have established a joint laboratory with renowned university, sharing the most advanced lapping and polishing processes. 

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